{"product_id":"3d-interconnect-architectures-for-heterogeneous-technologies-modeling-and-optimization-9783030982317","title":"3D Interconnect Architectures for Heterogeneous Technologies: Modeling and Optimization","description":"\u003cp\u003e\u003cstrong\u003eFormat\u003c\/strong\u003e: Paperback \/ softback\u003cbr\u003e\u003cstrong\u003eLength\u003c\/strong\u003e: 395 pages\u003cbr\u003e\u003cstrong\u003ePublication date\u003c\/strong\u003e: 29 June 2023\u003cbr\u003e\u003cstrong\u003ePublisher\u003c\/strong\u003e: Springer Nature Switzerland AG\u003cbr\u003e\u003c\/p\u003e\u003cp\u003eThis book describes the first comprehensive approach to the optimization of interconnect architectures in 3D systems on chips (SoCs), specially addressing the challenges and opportunities arising from heterogeneous integration.\u003c\/p\u003e\u003cp\u003e\u003cbr\u003e\u003cstrong\u003eDimension\u003c\/strong\u003e: 235 x 155 (mm)\u003cbr\u003e\u003cstrong\u003eISBN-13\u003c\/strong\u003e: 9783030982317\u003cbr\u003e \u003cstrong\u003eEdition number\u003c\/strong\u003e: 1st ed. 2022\u003c\/p\u003e","brand":"Lennart Bamberg,Jan Moritz Joseph,Alberto Garcia-Ortiz,Thilo Pionteck","offers":[{"title":"Paperback \/ softback","offer_id":45822638817530,"sku":"9783030982317","price":91.62,"currency_code":"GBP","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0522\/4297\/2845\/files\/1714156374692_book.jpg?v=1714421778","url":"https:\/\/shulphink.com\/products\/3d-interconnect-architectures-for-heterogeneous-technologies-modeling-and-optimization-9783030982317","provider":"Shulph Ink","version":"1.0","type":"link"}