{"product_id":"avoiding-inelastic-strains-in-solder-joint-interconnections-of-ic-devices-9780367635886","title":"Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices","description":"\u003cp\u003e\u003cstrong\u003eFormat\u003c\/strong\u003e: Paperback \/ softback\u003cbr\u003e\u003cstrong\u003eLength\u003c\/strong\u003e: 382 pages\u003cbr\u003e\u003cstrong\u003ePublication date\u003c\/strong\u003e: 04 October 2024\u003cbr\u003e\u003cstrong\u003ePublisher\u003c\/strong\u003e: Taylor \u0026amp; Francis Ltd\u003cbr\u003e\u003c\/p\u003e\u003cp\u003eThe book addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime.\u003c\/p\u003e\u003cp\u003e\u003cstrong\u003eWeight\u003c\/strong\u003e: 453g\u003cbr\u003e\u003cstrong\u003eDimension\u003c\/strong\u003e: 234 x 156 (mm)\u003cbr\u003e\u003cstrong\u003eISBN-13\u003c\/strong\u003e: 9780367635886\u003c\/p\u003e","brand":"EphraimSuhir","offers":[{"title":"Paperback \/ softback","offer_id":47870409048314,"sku":"9780367635886","price":57.11,"currency_code":"GBP","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0522\/4297\/2845\/files\/1761357340265_book.jpg?v=1761468729","url":"https:\/\/shulphink.com\/products\/avoiding-inelastic-strains-in-solder-joint-interconnections-of-ic-devices-9780367635886","provider":"Shulph Ink","version":"1.0","type":"link"}