{"product_id":"direct-copper-interconnection-for-advanced-semiconductor-technology-9781032528403","title":"Direct Copper Interconnection for Advanced Semiconductor Technology","description":"\u003cp\u003e\u003cstrong\u003eFormat\u003c\/strong\u003e: Paperback \/ softback\u003cbr\u003e\u003cstrong\u003eLength\u003c\/strong\u003e: 448 pages\u003cbr\u003e\u003cstrong\u003ePublication date\u003c\/strong\u003e: 21 May 2026\u003cbr\u003e\u003cstrong\u003ePublisher\u003c\/strong\u003e: Taylor \u0026amp; Francis Ltd\u003cbr\u003e\u003c\/p\u003e\u003cp\u003eIn the “More than Moore” era, performance requirements for leading edge semiconductor devices are demanding extremely fine pitch interconnection in semiconductor packaging.\u003c\/p\u003e\u003cp\u003e\u003cstrong\u003eWeight\u003c\/strong\u003e: 850g\u003cbr\u003e\u003cstrong\u003eDimension\u003c\/strong\u003e: 234 x 156 (mm)\u003cbr\u003e\u003cstrong\u003eISBN-13\u003c\/strong\u003e: 9781032528403\u003c\/p\u003e","brand":"Shulph Ink","offers":[{"title":"Paperback \/ softback","offer_id":48973620347130,"sku":"9781032528403","price":79.0,"currency_code":"GBP","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0522\/4297\/2845\/files\/1780709403102_book.jpg?v=1780816203","url":"https:\/\/shulphink.com\/products\/direct-copper-interconnection-for-advanced-semiconductor-technology-9781032528403","provider":"Shulph Ink","version":"1.0","type":"link"}