{"product_id":"electrical-and-computer-engineering-first-international-congress-iceceng-2022-virtual-event-february-912-2022-proceedings-9783031019838","title":"Electrical and Computer Engineering: First International Congress, ICECENG 2022, Virtual Event, February 9-12, 2022, Proceedings","description":"\u003cp\u003e\u003cstrong\u003eFormat\u003c\/strong\u003e: Paperback \/ softback\u003cbr\u003e\u003cstrong\u003eLength\u003c\/strong\u003e: 217 pages\u003cbr\u003e\u003cstrong\u003ePublication date\u003c\/strong\u003e: 11 May 2022\u003cbr\u003e\u003cstrong\u003ePublisher\u003c\/strong\u003e: Springer International Publishing AG\u003cbr\u003e\u003c\/p\u003e\u003cp\u003eThis book constitutes the refereed proceedings of the First International Congress, ICECENG 2022, held in February 2022. The papers detail the application of formal methods to the construction and analysis of models describing technological processes at both micro and macro levels.\u003c\/p\u003e\u003cp\u003e\u003cstrong\u003eWeight\u003c\/strong\u003e: 355g\u003cbr\u003e\u003cstrong\u003eDimension\u003c\/strong\u003e: 235 x 155 (mm)\u003cbr\u003e\u003cstrong\u003eISBN-13\u003c\/strong\u003e: 9783031019838\u003cbr\u003e \u003cstrong\u003eEdition number\u003c\/strong\u003e: 1st ed. 2022\u003c\/p\u003e","brand":"Shulph Ink","offers":[{"title":"Paperback \/ softback","offer_id":44102935904506,"sku":"9783031019838","price":55.5,"currency_code":"GBP","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0522\/4297\/2845\/products\/1662163863739_book.jpg?v=1662414371","url":"https:\/\/shulphink.com\/products\/electrical-and-computer-engineering-first-international-congress-iceceng-2022-virtual-event-february-912-2022-proceedings-9783031019838","provider":"Shulph Ink","version":"1.0","type":"link"}