{"product_id":"electromigration-in-metals-fundamentals-to-nanointerconnects-9781107032385","title":"Electromigration in Metals: Fundamentals to Nano-Interconnects","description":"\u003cp\u003e\u003c\/p\u003e\u003cblockquote\u003eThis book provides a comprehensive and practical resource for assessing electromigration reliability and designing more resilient chips. It covers fundamental physics, microstructure, interfaces, processing, characterisation, testing, and analysis, and offers practical modeling methodologies for statistical analysis. It is ideal for materials scientists and reliability and chip design engineers. \u003c\/blockquote\u003e\u003cp\u003e\u003cstrong\u003eFormat\u003c\/strong\u003e: Hardback\u003cbr\u003e\u003cstrong\u003eLength\u003c\/strong\u003e: 430 pages\u003cbr\u003e\u003cstrong\u003ePublication date\u003c\/strong\u003e: 12 May 2022\u003cbr\u003e\u003cstrong\u003ePublisher\u003c\/strong\u003e: Cambridge University Press\u003cbr\u003e\u003c\/p\u003e \u003cp\u003e\u003cbr\u003eThis comprehensive and practical resource empowers readers to develop highly reliable on-chip wiring stacks and power grids. Beginning with fundamental physics and progressing to advanced methodologies, the book enables the reader to create robust on-chip interconnects, spanning from microscale to nanoscale. Through a detailed examination of the role of microstructure, interfaces, and processing in electromigration reliability, as well as characterisation, testing, and analysis, the book traces the evolution of on-chip interconnects. Practical modelling methodologies for statistical analysis, ranging from simple 1D approximation to complex 3D description, facilitate the step-by-step development of reliable on-chip wiring stacks and industrial-grade power\/ground grids. This invaluable resource is particularly suited for materials scientists and reliability and chip design engineers.\u003cbr\u003e\u003cbr\u003e\u003c\/p\u003e\u003cp\u003eThis comprehensive and practical resource empowers readers to develop highly reliable on-chip wiring stacks and power grids. Beginning with fundamental physics and progressing to advanced methodologies, the book enables the reader to create robust on-chip interconnects, spanning from microscale to nanoscale. Through a detailed examination of the role of microstructure, interfaces, and processing in electromigration reliability, as well as characterisation, testing, and analysis, the book traces the evolution of on-chip interconnects. Practical modelling methodologies for statistical analysis, ranging from simple 1D approximation to complex 3D description, facilitate the step-by-step development of reliable on-chip wiring stacks and industrial-grade power\/ground grids. This invaluable resource is particularly suited for materials scientists and reliability and chip design engineers.\u003c\/p\u003e\u003cp\u003e\u003cstrong\u003eWeight\u003c\/strong\u003e: 978g\u003cbr\u003e\u003cstrong\u003eDimension\u003c\/strong\u003e: 176 x 251 x 27 (mm)\u003cbr\u003e\u003cstrong\u003eISBN-13\u003c\/strong\u003e: 9781107032385\u003c\/p\u003e","brand":"Paul S.Ho,Chao-Kun Hu,Martin Gall,Valeriy Sukharev","offers":[{"title":"Hardback","offer_id":44216397136122,"sku":"9781107032385","price":74.26,"currency_code":"GBP","in_stock":false}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0522\/4297\/2845\/products\/1683288036861_book.jpg?v=1683354943","url":"https:\/\/shulphink.com\/products\/electromigration-in-metals-fundamentals-to-nanointerconnects-9781107032385","provider":"Shulph Ink","version":"1.0","type":"link"}