{"product_id":"electronic-materials-innovations-and-reliability-in-advanced-memory-packaging-9783031947940","title":"Electronic Materials Innovations and Reliability in Advanced Memory Packaging","description":"This book provides a comprehensive introduction the reliability, and electronic materials innovations in advanced memory device packaging from component to system level. Special features of this book are sections covering not only the advanced packaging materials, but also system level packaging and integration in memory modules and solid state drives (SSD).   The book is an extremely useful and applicable guide to professionals and students on materials reliability in memory device packaging - from component to system level.\u003cul\u003e\n\u003cli\u003e\n\u003cstrong\u003ePublication date:\u003c\/strong\u003e 22 July 2025\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003ePage count:\u003c\/strong\u003e 178\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eDimensions:\u003c\/strong\u003e Height 235 mm; Width 155 mm\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003ePublisher:\u003c\/strong\u003e Springer International Publishing AG\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eFormat:\u003c\/strong\u003e Hardback\u003c\/li\u003e\n\u003cli\u003e\n\u003cstrong\u003eISBN-13:\u003c\/strong\u003e 9783031947940\u003c\/li\u003e\n\u003c\/ul\u003e","brand":"Chen Yu Huang","offers":[{"title":"Hardback","offer_id":50207274664186,"sku":"9783031947940","price":115.63,"currency_code":"GBP","in_stock":false}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0522\/4297\/2845\/files\/9783031947940.jpg?v=1788222115","url":"https:\/\/shulphink.com\/products\/electronic-materials-innovations-and-reliability-in-advanced-memory-packaging-9783031947940","provider":"Shulph Ink","version":"1.0","type":"link"}