{"product_id":"thermal-and-structural-electronic-packaging-analysis-for-space-and-extreme-environments-9781032160856","title":"Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments","description":"\u003cp\u003e\u003cstrong\u003eFormat\u003c\/strong\u003e: Paperback \/ softback\u003cbr\u003e\u003cstrong\u003eLength\u003c\/strong\u003e: 290 pages\u003cbr\u003e\u003cstrong\u003ePublication date\u003c\/strong\u003e: 26 August 2024\u003cbr\u003e\u003cstrong\u003ePublisher\u003c\/strong\u003e: Taylor \u0026amp; Francis Ltd\u003cbr\u003e\u003c\/p\u003e\u003cp\u003eThis book provides useful and practical approaches to solving the most complex thermal-structural problems ever attempted for design spacecraft to survive the severe cold of deep space, as well as the unforgiving temperature swings on the surface of Mars.\u003c\/p\u003e\u003cp\u003e\u003cstrong\u003eWeight\u003c\/strong\u003e: 560g\u003cbr\u003e\u003cstrong\u003eDimension\u003c\/strong\u003e: 234 x 156 (mm)\u003cbr\u003e\u003cstrong\u003eISBN-13\u003c\/strong\u003e: 9781032160856\u003c\/p\u003e","brand":"Juan Cepeda-Rizo,Jeremiah Gayle,Joshua Ravich","offers":[{"title":"Paperback \/ softback","offer_id":46667661771002,"sku":"9781032160856","price":46.64,"currency_code":"GBP","in_stock":false}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0522\/4297\/2845\/files\/1726263691234_book.jpg?v=1726685435","url":"https:\/\/shulphink.com\/products\/thermal-and-structural-electronic-packaging-analysis-for-space-and-extreme-environments-9781032160856","provider":"Shulph Ink","version":"1.0","type":"link"}