{"product_id":"thermomechanical-simulation-methodologies-for-advanced-semiconductor-packaging-9781837241408","title":"Thermomechanical Simulation Methodologies for Advanced Semiconductor Packaging","description":"\u003cp\u003e\u003cstrong\u003eFormat\u003c\/strong\u003e: Hardback\u003cbr\u003e\u003cstrong\u003eLength\u003c\/strong\u003e: 199 pages\u003cbr\u003e\u003cstrong\u003ePublication date\u003c\/strong\u003e: 01 July 2025\u003cbr\u003e\u003cstrong\u003ePublisher\u003c\/strong\u003e: Institution of Engineering and Technology\u003cbr\u003e\u003c\/p\u003e\u003cp\u003eThere is a growing demand for more accurate simulation techniques to address the thermomechanical challenges faced in advanced electronic packaging. This book compiles the latest advancements in thermomechanical simulation methodologies, empowering readers with the knowledge to help optimize electronic package designs.\u003c\/p\u003e\u003cp\u003e\u003cbr\u003e\u003cstrong\u003eDimension\u003c\/strong\u003e: 234 x 156 (mm)\u003cbr\u003e\u003cstrong\u003eISBN-13\u003c\/strong\u003e: 9781837241408\u003c\/p\u003e","brand":"ShuyeZhang,GuoliSun","offers":[{"title":"Hardback","offer_id":49718803169530,"sku":"9781837241408","price":140.3,"currency_code":"GBP","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0522\/4297\/2845\/files\/1783719408620_book.jpg?v=1784368861","url":"https:\/\/shulphink.com\/products\/thermomechanical-simulation-methodologies-for-advanced-semiconductor-packaging-9781837241408","provider":"Shulph Ink","version":"1.0","type":"link"}