{"product_id":"tsv-3d-rf-integration-high-resistivity-si-interposer-technology-9780323996020","title":"TSV 3D RF Integration: High Resistivity Si Interposer Technology","description":"\u003cp\u003e\u003c\/p\u003e\u003cblockquote\u003eThe book \"TSV 3D RF Integration: High Resistivity Si Interposer Technology\" provides a comprehensive guide to the design, process development, and application verification of high-resistivity silicon interposer technology. It includes detailed demonstrations of the design and process development, case studies, and a systematic literature review. The book is a valuable resource for researchers and engineers in microelectronics, offering practical insights and solutions for 3D heterogenous RF integration. \u003c\/blockquote\u003e\u003cp\u003e\u003cstrong\u003eFormat\u003c\/strong\u003e: Paperback \/ softback\u003cbr\u003e\u003cstrong\u003eLength\u003c\/strong\u003e: 292 pages\u003cbr\u003e\u003cstrong\u003ePublication date\u003c\/strong\u003e: 27 April 2022\u003cbr\u003e\u003cstrong\u003ePublisher\u003c\/strong\u003e: Elsevier - Health Sciences Division\u003cbr\u003e\u003c\/p\u003e \u003cp\u003e\u003cbr\u003eTSV 3D RF Integration: High Resistivity Si Interposer Technology delves into the intricate design, process development, and application verification of high-resistivity silicon interposer technology, addressing the challenges of high-frequency loss and high integration levels. This comprehensive book offers a detailed demonstration of the design and process development of Hr-Si interposer technology, complemented by case studies and a systematic literature review. It serves as a valuable resource for users, providing comprehensive demonstrations of the design and process development of HR-Si interposer technologies, including quality monitoring and methods to extract S parameters.\u003cbr\u003e\u003cbr\u003eA series of cases are presented, encompassing an example of an integrated inductor, a microstrip inter-digital filter, and a stacked patch antenna. Each chapter includes a systematic and comparative review of the research literature, providing researchers and engineers in microelectronics with a unique handbook to aid in solving problems in 3D heterogeneous RF integration oriented Hr-Si interposer technology.\u003c\/p\u003e\u003cp\u003e\u003cstrong\u003eWeight\u003c\/strong\u003e: 450g\u003cbr\u003e\u003cstrong\u003eDimension\u003c\/strong\u003e: 235 x 191 (mm)\u003cbr\u003e\u003cstrong\u003eISBN-13\u003c\/strong\u003e: 9780323996020\u003c\/p\u003e","brand":"ShenglinMa,YufengJin","offers":[{"title":"Paperback \/ softback","offer_id":44096431194362,"sku":"9780323996020","price":212.35,"currency_code":"GBP","in_stock":false}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0522\/4297\/2845\/products\/noImage_1_37e3b24c-0520-4161-b65b-c35707eea109.jpg?v=1657606140","url":"https:\/\/shulphink.com\/products\/tsv-3d-rf-integration-high-resistivity-si-interposer-technology-9780323996020","provider":"Shulph Ink","version":"1.0","type":"link"}