3rd International Conference on Wireless, Intelligent and Distributed Environment for Communication: WIDECOM 2020
3rd International Conference on Wireless, Intelligent and Distributed Environment for Communication: WIDECOM 2020
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The 3rd International Conference on Wireless Intelligent and Distributed Environment for Communication (WIDECOM 2020) seeks to explore new dependability paradigms, design, and performance of dependable network computing and mobile systems, as well as security issues. The conference provides a platform for researchers, students, scientists, and engineers to share experiences, ideas, and research results in these areas.
Format: Paperback / softback
Length: 188 pages
Publication date: 24 June 2021
Publisher: Springer Nature Switzerland AG
The 3rd International Conference on Wireless Intelligent and Distributed Environment for Communication (WIDECOM 2020) was a remarkable event sponsored by Ryerson University,Toronto,Canada,from May 6th to 8th,2020. This conference brought together a diverse group of researchers, students, scientists, and engineers from both academia and industry to explore cutting-edge advancements in the field of wireless communication and intelligent distributed environments.
The conference aimed to provide a platform for exchanging ideas, sharing experiences, and presenting the latest research results in the areas of new dependability paradigms, design, and performance of dependable network computing and mobile systems. Additionally, it addressed critical issues related to the security of these systems, recognizing the importance of protecting information and establishing trust in the digital space.
The conference proceedings encompassed a wide range of topics, including networking computing, mobile/ubiquitous systems, cloud systems, and IoT systems. The presentations and discussions covered a diverse array of subjects, ranging from the development of resilient communication networks to the integration of artificial intelligence and machine learning in wireless systems.
One of the key highlights of WIDECOM 2020 was the emphasis on addressing new dependability paradigms. The conference sought to explore innovative approaches and technologies that can enhance the reliability, availability, and maintainability of wireless networks and computing systems. The discussions covered topics such as fault tolerance, self-healing, and self-organization, which are crucial in ensuring the robustness and resilience of modern communication networks.
Another important aspect of the conference was the focus on design and performance of dependable network computing and mobile systems. The presentations showcased the latest advancements in network architecture, protocol design, and resource management, aimed at improving the efficiency, scalability, and reliability of these systems. The discussions also explored the challenges associated with developing secure and reliable mobile systems, particularly in the context of emerging technologies such as 5G and IoT.
In addition to the technical sessions, WIDECOM 2020 featured a number of keynote lectures and panel discussions. These sessions provided insights into the latest trends, challenges, and opportunities in the field of wireless communication and intelligent distributed environments. The speakers included renowned experts from both academia and industry, who shared their expertise and perspectives on the most pressing issues facing the industry.
Overall, the 3rd International Conference on Wireless Intelligent and Distributed Environment for Communication (WIDECOM 2020) was a resounding success. It brought together a diverse group of experts and enthusiasts from around the world, fostering a collaborative environment for exchanging ideas and advancing the state-of-the-art in wireless communication and intelligent distributed environments. The conference proceedings will serve as a valuable resource for researchers, students, and practitioners in the field, providing them with insights and inspiration for future research and development.
Weight: 454g
Dimension: 235 x 155 (mm)
ISBN-13: 9783030443740
Edition number: 1st ed. 2020
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