Advances in Chemical Mechanical Planarization (CMP)

CMP is a crucial process for semiconductor manufacturing, and the second edition of this book provides the latest information on advances in CMP and its emerging materials, methods, and applications. It covers CMP of dielectric and metal films, consumables and process control, and challenges with tungsten, cobalt, and ruthenium as interconnect and barrier films.

Format: Paperback / softback
Length: 648 pages
Publication date: 16 September 2021
Publisher: Elsevier Science Publishing Co Inc

The second edition of Advances in Chemical Mechanical Planarization (CMP), a comprehensive and essential guide for high-volume, high-yield semiconductor manufacturing, has been released. In this ever-evolving field, where device dimensions continue to shrink, CMP plays a pivotal role in ensuring the precision and quality of electronic components. This updated edition encompasses the latest advancements in CMP technology, materials, methods, and applications, including comprehensive coverage of post-CMP cleaning challenges and tribology of CMP.

Part one of the book delves into the CMP of dielectric and metal films, exploring the use of current and emerging techniques and processes for processing various materials, such as ultra-low-k materials and high-mobility channel materials. The chapter concludes with a review of the environmental impacts of CMP processes.

New content in this edition addresses CMP challenges with tungsten, cobalt, and ruthenium as interconnect and barrier films, as well as consumables for ultralow topography and CMP for memory devices.

Part two of the book focuses on consumables and process control for improved CMP. Chapters cover CMP pads, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes, and approaches for defect characterization, mitigation, and reduction.

Advances in Chemical Mechanical Planarization (CMP), Second Edition is a valuable resource and a key reference for materials scientists, engineers, and researchers in academia and the semiconductor industry. It provides a systematic review of fundamentals and advances in CMP, covering key topics such as dielectric and metal film CMP, consumables, and process control. With its comprehensive coverage and up-to-date information, this book is essential for anyone seeking to stay at the forefront of this rapidly evolving field.

Weight: 1000g
Dimension: 229 x 152 (mm)
ISBN-13: 9780128217917
Edition number: 2 ed