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Shulph Ink

Advances in Micro-Electronics, Embedded Systems and IoT: Proceedings of Sixth International Conference on Microelectronics, Electromagnetics and Telecommunications (ICMEET 2021), Volume 1

Advances in Micro-Electronics, Embedded Systems and IoT: Proceedings of Sixth International Conference on Microelectronics, Electromagnetics and Telecommunications (ICMEET 2021), Volume 1

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  • More about Advances in Micro-Electronics, Embedded Systems and IoT: Proceedings of Sixth International Conference on Microelectronics, Electromagnetics and Telecommunications (ICMEET 2021), Volume 1

This book discusses the latest developments and future trends in microelectronics, electromagnetics, and telecommunication, with original research works presented at ICMEET 2021.

Format: Hardback
Length: 549 pages
Publication date: 23 April 2022
Publisher: Springer Verlag, Singapore


This comprehensive book delves into the latest advancements and forecasts future trends in the dynamic fields of microelectronics, electromagnetics, and telecommunications. It presents original research papers, meticulously crafted by esteemed scientists, research scholars, and practitioners from renowned universities, engineering colleges, and R&D institutes across the globe. These papers showcase the most recent breakthroughs and offer promising solutions to the most pressing challenges confronting our society today.

The book is organized into several chapters, each dedicated to exploring specific aspects of these fields. The chapters cover a wide range of topics, including microelectronic devices, electromagnetic waves, communication systems, and emerging technologies. Each paper presents a detailed analysis of the latest research findings, theoretical developments, and practical applications, providing readers with a deep understanding of the current state-of-the-art and the potential future directions of these disciplines.

The authors of these papers are drawn from a diverse range of backgrounds and expertise, ensuring a comprehensive and interdisciplinary perspective. The book serves as a valuable resource for researchers, scholars, engineers, and professionals seeking to stay updated with the latest developments and trends in microelectronics, electromagnetics, and telecommunications. It offers insightful insights and valuable perspectives that will contribute to the ongoing progress and innovation in these fields.

In conclusion, this book is a must-read for anyone interested in the latest developments and future trends in microelectronics, electromagnetics, and telecommunications. It provides a comprehensive and authoritative overview of the state-of-the-art research and offers valuable insights into the most pressing issues facing our society today.

Weight: 1010g
Dimension: 235 x 155 (mm)
ISBN-13: 9789811685491
Edition number: 1st ed. 2022

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