Shulph Ink
Advances in Micro-Electronics, Embedded Systems and IoT: Proceedings of Sixth International Conference on Microelectronics, Electromagnetics and Telecommunications (ICMEET 2021), Volume 1
Advances in Micro-Electronics, Embedded Systems and IoT: Proceedings of Sixth International Conference on Microelectronics, Electromagnetics and Telecommunications (ICMEET 2021), Volume 1
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- More about Advances in Micro-Electronics, Embedded Systems and IoT: Proceedings of Sixth International Conference on Microelectronics, Electromagnetics and Telecommunications (ICMEET 2021), Volume 1
This book summarizes the latest developments and future trends in microelectronics, electromagnetics, and telecommunication, with original research works presented at ICMEET 2021.
Format: Paperback / softback
Length: 549 pages
Publication date: 23 April 2023
Publisher: Springer Verlag, Singapore
This comprehensive book delves into the latest advancements and forecasts future trends in the dynamic fields of microelectronics, electromagnetics, and telecommunications. It presents original research works that were showcased at the International Conference on Microelectronics, Electromagnetics, and Telecommunication (ICMEET 2021), which took place in Bhubaneswar, Odisha, India, from August 27 to 28, 2021. These papers were authored by esteemed scientists, research scholars, and practitioners from renowned universities, engineering colleges, and R&D institutes across the globe, showcasing their expertise and contributions to the field. The content of the book encompasses a wide range of topics, including emerging technologies, cutting-edge research, and innovative solutions to pressing societal challenges. By presenting the latest breakthroughs and promising solutions, this publication serves as a valuable resource for scholars, researchers, and professionals seeking to stay informed about the latest developments in these interconnected domains.
Weight: 860g
Dimension: 235 x 155 (mm)
ISBN-13: 9789811685521
Edition number: 1st ed. 2022
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