Chiplet Design and Heterogeneous Integration Packaging

Chiplet design and heterogeneous integration packaging are covered in the book, with a focus on engineering practice. It provides in-depth study on major topics such as chip partitioning, chip splitting, multiple system and heterogeneous integration, and system-in-package. It is beneficial for researchers, engineers, and graduate students in electrical engineering, mechanical engineering, materials sciences, and industry engineering.

Format: Hardback
Length: 525 pages
Publication date: 28 March 2023
Publisher: Springer Verlag, Singapore

The book delves into the intricate realm of chiplet design and heterogeneous integration packaging, encompassing a comprehensive range of topics. It provides a thorough exploration of both principles and engineering practices, with a significant emphasis on practical applications. This is accomplished through in-depth examinations of key subjects such as chip partitioning, chip splitting, multiple system and heterogeneous integration with TSV-interposers, multiple system and heterogeneous integration with TSV-less interposers, chiplets lateral communication, system-in-package, fan-out wafer/panel-level packaging, and various Cu-Cu hybrid bonding.

This comprehensive resource is invaluable for researchers, engineers, and graduate students pursuing careers in electrical engineering, mechanical engineering, materials sciences, and industry engineering, among other fields. It offers a deep understanding of the latest advancements and challenges in chiplet design and heterogeneous integration packaging, equipping them with the skills and knowledge necessary to excel in their respective domains.

The book is organized into well-structured chapters, each dedicated to a specific aspect of chiplet design and heterogeneous integration packaging. Each chapter begins with an introduction that provides a brief overview of the topic, followed by detailed explanations and illustrations. The text is accompanied by numerous figures, tables, and diagrams that further enhance the understanding of the subject matter.

Furthermore, the book includes case studies and real-world examples that demonstrate the practical applications of the discussed concepts. These case studies provide insights into the challenges and opportunities faced by industry professionals in the field, and help readers apply the theoretical knowledge to real-world scenarios.

In conclusion, the book serves as a valuable resource for anyone interested in chiplet design and heterogeneous integration packaging. It offers a comprehensive and up-to-date coverage of the field, providing a deep understanding of the principles, techniques, and applications involved. Whether you are a researcher, engineer, or student, this book will undoubtedly enhance your knowledge and skills in this rapidly evolving area.

Weight: 1068g
Dimension: 162 x 242 x 33 (mm)
ISBN-13: 9789811999161
Edition number: 1st ed. 2023