Shulph Ink
Device Circuit Co-Design Issues in FETs
Device Circuit Co-Design Issues in FETs
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Excellent- More about Device Circuit Co-Design Issues in FETs
Device Circuit Co-Design Issues in FETs is a book that provides an overview of emerging semiconductor devices and their applications in electronic circuits. It discusses challenges and scope of FinFET device circuits, 3D FETs, advanced FET for circuit applications, low-power memory design, neuromorphic computing, and thermal reliability. It is intended for students, researchers, and professionals in the field of semiconductor devices and nanodevices.
Format: Hardback
Length: 262 pages
Publication date: 22 August 2023
Publisher: Taylor & Francis Ltd
This comprehensive book offers a thorough exploration of the latest advancements in semiconductor devices and their applications in electronic circuits, serving as a foundational resource for electronic devices. In Device Circuit Co-Design Issues in FETs, readers gain a deeper understanding of the rapidly evolving realm of low-power electronic devices and their diverse applications across wireless, biosensing, and circuit domains. The book brings together experts from various fields within the VLSI domain to address the emerging challenges and opportunities in the engineering and practical applications of advanced low-power devices.
The chapters delve into the complexities and potential of FinFET device circuits, 3D FETs, and advanced FETs for circuit applications. Additionally, the book addresses critical topics such as low-power memory design, neuromorphic computing, and thermal reliability, ensuring a comprehensive coverage of the field.
The authors possess a solid grasp of device physics and circuits, and they discuss innovative transistor designs based on new channel/dielectric materials and device architectures to achieve remarkable low-power dissipation and ultra-high switching speeds. This book is designed to cater to students, researchers, and professionals engaged in the fields of semiconductor devices and nanodevices, as well as those involved in device-circuit co-design issues.
By delving into the latest developments and addressing key challenges, this book provides valuable insights and practical knowledge for those seeking to stay at the forefront of this dynamic and rapidly evolving field.
Weight: 675g
Dimension: 234 x 156 (mm)
ISBN-13: 9781032414256
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