Distributed Applications and Interoperable Systems

This book presents the refereed proceedings of the DAIS 2022 conference, covering topics such as distributed applications, middleware, software engineering, and experimental studies.

Format: Paperback / softback
Length: 201 pages
Publication date: 07 September 2022
Publisher: Springer International Publishing AG

The 22nd IFIP WG 6.1 International Conference on Distributed Applications and Interoperable Systems, DAIS 2022, was held in Lucca, Italy, in June 2022, as part of the 17th International Federated Conference on Distributed Computing Techniques, DisCoTec 2022. This book encompasses the refereed proceedings of the conference, featuring 9 full papers and 2 short papers that underwent rigorous review and selection from a total of 19 submissions. DAIS serves as a platform for disseminating cutting-edge research on distributed applications, encompassing their design, modeling, implementation, operation, supporting middleware, software engineering methodologies, and tools. It also explores experimental studies and applications in this field.

Distributed applications have become increasingly important in today's interconnected world, where systems and services are distributed across multiple devices and locations. DAIS 2022 aimed to bring together researchers and practitioners from around the globe to explore the latest advancements and challenges in distributed applications and interoperable systems.

The conference featured a wide range of topics, including but not limited to:

Distributed Application Design and Modeling: This session focused on developing effective models and methodologies for designing distributed applications that can handle the complexity and heterogeneity of modern computing environments.

Distributed Application Implementation and Operation: This session explored the challenges and techniques for implementing and operating distributed applications, including fault tolerance, scalability, and resource management.

Supporting Middleware: This session discussed the role of middleware in enabling distributed applications, including message-passing middleware, distributed object systems, and service-oriented architectures.

Software Engineering Methodologies and Tools: This session explored the use of software engineering methodologies and tools for developing distributed applications, including agile methodologies, model-driven engineering, and cloud computing.

Experimental Studies and Applications: This session showcased experimental studies and applications of distributed applications in various domains, such as healthcare, finance, and social networks.

The papers presented at DAIS 2022 covered a wide range of topics and approaches, reflecting the state-of-the-art in distributed applications research. The conference provided a forum for researchers and practitioners to exchange ideas, share experiences, and collaborate on future research directions.

Overall, DAIS 2022 was a successful event that contributed to the advancement of distributed applications and interoperable systems research. The conference proceedings will be valuable for researchers, practitioners, and students interested in this field.

The 22nd IFIP WG 6.1 International Conference on Distributed Applications and Interoperable Systems, DAIS 2022, was held in Lucca, Italy, in June 2022, as part of the 17th International Federated Conference on Distributed Computing Techniques, DisCoTec 2022. This book encompasses the refereed proceedings of the conference, featuring 9 full papers and 2 short papers that underwent rigorous review and selection from a total of 19 submissions. DAIS serves as a platform for disseminating cutting-edge research on distributed applications, encompassing their design, modeling, implementation, operation, supporting middleware, software engineering methodologies, and tools. It also explores experimental studies and applications in this field.

Distributed applications have become increasingly important in today's interconnected world, where systems and services are distributed across multiple devices and locations. DAIS 2022 aimed to bring together researchers and practitioners from around the globe to explore the latest advancements and challenges in distributed applications and interoperable systems.

The conference featured a wide range of topics, including but not limited to:

Distributed Application Design and Modeling: This session focused on developing effective models and methodologies for designing distributed applications that can handle the complexity and heterogeneity of modern computing environments.

Distributed Application Implementation and Operation: This session explored the challenges and techniques for implementing and operating distributed applications, including fault tolerance, scalability, and resource management.

Supporting Middleware: This session discussed the role of middleware in enabling distributed applications, including message-passing middleware, distributed object systems, and service-oriented architectures.

Software Engineering Methodologies and Tools: This session explored the use of software engineering methodologies and tools for developing distributed applications, including agile methodologies, model-driven engineering, and cloud computing.

Experimental Studies and Applications: This session showcased experimental studies and applications of distributed applications in various domains, such as healthcare, finance, and social networks.

The papers presented at DAIS 2022 covered a wide range of topics and approaches, reflecting the state-of-the-art in distributed applications research. The conference provided a forum for researchers and practitioners to exchange ideas, share experiences, and collaborate on future research directions.

Overall, DAIS 2022 was a successful event that contributed to the advancement of distributed applications and interoperable systems research. The conference proceedings will be valuable for researchers, practitioners, and students interested in this field.

Weight: 338g
Dimension: 235 x 155 (mm)
ISBN-13: 9783031160912
Edition number: 1st ed. 2022