Dual-Mass Linear Vibration Silicon-Based MEMS Gyroscope

This book provides an in-depth exploration of the key technologies involved in the manufacture of double-mass line vibrating silicon micromechanical gyroscope, including gyrostructure design, detection technology, orthogonal correction technology, temperature influence, and measurement and control system framework. It offers a comprehensive understanding of silicon-based MEMS gyroscopes and their structural design, benefiting researchers and readers alike.

Format: Hardback
Length: 224 pages
Publication date: 18 April 2023
Publisher: Springer Verlag, Singapore

This comprehensive book delves into the intricate details of the key technologies involved in the manufacturing of double-mass line vibrating silicon micromechanical gyroscope. It provides a detailed exploration of the gyrostructure design, detection technology, orthogonal correction techniques, the impact of temperature, and the framework for designing measurement and control systems. With clear illustrations and comprehensive explanations, the text aims to enhance the understanding of researchers working with silicon-based MEMS gyroscopes while offering a fresh perspective on the structural design and construction of dual-mass gyroscopes.

The principle, structure, and related technologies of silicon-based MEMS gyroscopes are presented in this comprehensive book. It enlightens researchers in silicon-based MEMS gyroscopes and provides readers with a fresh understanding of the structural design and construction of dual-mass gyroscopes.

The design of gyrostructure plays a crucial role in the performance of silicon micromechanical gyroscopes. It involves the careful selection and arrangement of components to achieve the desired sensitivity, stability, and bandwidth. The book discusses various gyrostructure designs, including single-mass, double-mass, and hybrid configurations, and their advantages and disadvantages.

Detection technology is another critical aspect of silicon micromechanical gyroscope manufacturing. It involves the use of sensors to measure the motion of the gyroscope's mass and detect the resulting angular displacement. The book explores different detection technologies, such as capacitive sensing, strain gauge sensing, and optical sensing, and their respective advantages and limitations.

Orthogonal correction technology is employed to mitigate the effects of external disturbances and improve the accuracy and stability of the gyroscope. The book discusses various orthogonal correction techniques, such as passive, active, and hybrid approaches, and their implementation in silicon micromechanical gyroscopes.

Temperature is a significant factor that affects the performance of silicon micromechanical gyroscopes. The book explores the influence of temperature on the gyroscope's sensitivity, stability, and bandwidth. It discusses temperature compensation techniques, such as thermal tuning and self-heating, and their effectiveness in maintaining the gyroscope's performance within specified temperature ranges.

The design of measurement and control system framework is essential for the effective operation of silicon micromechanical gyroscopes. It involves the integration of sensors, actuators, and control algorithms to achieve the desired performance and stability. The book discusses the design principles of measurement and control systems and their implementation in silicon micromechanical gyroscopes.

In addition to these technical aspects, the book also provides insights into the manufacturing processes and materials used in silicon micromechanical gyroscopes. It discusses the challenges faced during the fabrication of MEMS devices and the techniques used to overcome them.

Overall, this comprehensive book offers a valuable resource for researchers, engineers, and students interested in silicon-based MEMS gyroscopes. It provides a detailed understanding of the key technologies involved in the manufacturing of double-mass line vibrating silicon micromechanical gyroscopes, and it serves as a foundation for further research and development in this field.

Weight: 524g
Dimension: 235 x 155 (mm)
ISBN-13: 9789811992469
Edition number: 1st ed. 2023