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Chen Yu Huang
Electronic Materials Innovations and Reliability in Advanced Memory Packaging
Electronic Materials Innovations and Reliability in Advanced Memory Packaging
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- Condition: Brand new
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- More about Electronic Materials Innovations and Reliability in Advanced Memory Packaging
This book provides a comprehensive introduction the reliability, and electronic materials innovations in advanced memory device packaging from component to system level. Special features of this book are sections covering not only the advanced packaging materials, but also system level packaging and integration in memory modules and solid state drives (SSD). The book is an extremely useful and applicable guide to professionals and students on materials reliability in memory device packaging - from component to system level.
- Publication date: 22 July 2025
- Page count: 178
- Dimensions: Height 235 mm; Width 155 mm
- Publisher: Springer International Publishing AG
- Format: Hardback
- ISBN-13: 9783031947940
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