Hybrid Systems-in-Foil

Hybrid Systems-in-Foil (HySiF) combines CMOS SoCs and larger area organic and printed electronics in a polymeric substrate to create flexible electronic systems. It offers an economical implementation by integrating a minimum number of embedded silicon chips and a maximum number of on-foil components.

Format: Paperback / softback
Length: 75 pages
Publication date: 14 October 2021
Publisher: Cambridge University Press

Hybrid Systems-in-Foil (HySiF) is a groundbreaking concept that harnesses the potential of conventional More-than-More Systems-in/on-Package (SiPs and SoPs) for the flexible electronics realm. By integrating a minimum number of embedded silicon chips and a maximum number of on-foil components, HySiF enables the realization of cost-effective and flexible electronic systems. This innovative approach combines the complementary characteristics of CMOS SoCs and larger area organic and printed electronics within a HySiF-compatible polymeric substrate.

Within the scope of HySiF, the fabrication process steps and integration design rules are meticulously defined, taking into account material compatibility, surface properties, and thermal budget. This Element serves as an introductory guide to the HySiF concept. Furthermore, a comprehensive summary of recent ultra-thin chip fabrication and flexible packaging techniques is presented. Several bendable electronic components are showcased, highlighting the advantages of HySiF. Finally, prototypes of flexible wireless sensor systems that embrace the HySiF concept are demonstrated, showcasing its practical applications in the field of flexible electronics.

Weight: 152g
Dimension: 154 x 228 x 9 (mm)
ISBN-13: 9781108984744
Edition number: New ed