Shulph Ink
MicroSystem Based on SiP Technology
MicroSystem Based on SiP Technology
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- More about MicroSystem Based on SiP Technology
This book is a comprehensive SiP design guide book that covers concept and technology, design and simulation, project and case. It proposes new original concepts and thoughts, such as Function Density Law, Si³P, and 4D integration, and covers the latest technology of SiP and Advanced Packaging. Part two covers the latest SiP and Advanced Packaging design and simulation technologies, such as wire bonding, multi-step cavity, chip stacking, 2.5D TSV, 3D TSV, RDL, Fan- In, Fan- Out, Flip Chip, Embedded Passive, Embedded Chip, RF design, Rigid-Flex design, 4D SiP design, Multi-layout project, and Team design. Part three introduces the design, simulation, and implementation methods of different types of SiP, with a significant reference significance for the research and development of SiP projects.
Format: Hardback
Length: 874 pages
Publication date: 29 May 2022
Publisher: Springer Verlag, Singapore
This comprehensive SIP design guidebook is divided into three parts: concept and technology, design and simulation, and project and case, totaling 30 chapters. In Part one, the author introduces innovative concepts and thoughts, including Function Density Law, SiP, and 4D integration. Part one also covers the latest technology in SiP and Advanced Packaging. Part two delves into the latest SIP and Advanced Packaging design and simulation technologies, such as wire bonding, multi-step cavity, chip stacking, 2.5D TSV, 3D TSV, RDL, Fan-In, Fan-Out, Flip Chip, Embedded Passive, Embedded Chip, RF design, Rigid-Flex design, 4D SiP design, Multi-layout project, and Team design, as well as SI, PI, thermal simulation, electrical verification, and physical verification. Part three, based on a real design case, introduces the design, simulation, and implementation methods of different types of SiP, with significant reference significance for the research and development of SIP projects.
This book comprehensively and deeply explores the latest development, design ideas, and design methods of contemporary SIP technology from three perspectives: concept and technology, design and simulation, and project and case. Through detailed introductions of new concepts, design methods, actual projects, and cases, this book outlines the entire process of SIP products from conception to final realization, benefiting readers.
Weight: 1496g
Dimension: 235 x 155 (mm)
ISBN-13: 9789811900822
Edition number: 1st ed. 2022
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