Shulph Ink
Nano-Interconnect Materials and Models for Next Generation Integrated Circuit Design
Nano-Interconnect Materials and Models for Next Generation Integrated Circuit Design
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Excellent- More about Nano-Interconnect Materials and Models for Next Generation Integrated Circuit Design
This book discusses the use of novel nano-interconnect materials for 3D integrated circuit design, focusing on advanced nanomaterials like carbon nanotubes and graphene nanoribbons. It provides information on interconnect modeling, crosstalk noise analysis, and power supply voltage drop analysis.
Format: Hardback
Length: 212 pages
Publication date: 22 December 2023
Publisher: Taylor & Francis Ltd
The relentless pursuit of scaling device and interconnect dimensions in the nanometer regime has yielded a multitude of low-dimensional challenges. To address these complexities, this comprehensive book delves into the realm of novel nano-interconnect materials and interconnect modeling, emphasizing their pivotal role in 3D integrated circuit design. It offers valuable insights into advanced nanomaterials such as carbon nanotubes (CNT) and graphene nanoribbons (GNR), highlighting their potential for realizing interconnects, interconnect models, and analyzing crosstalk noise.
The book's key features include:
• A comprehensive exploration of materials and nanomaterials utilization in next-generation interconnects based on CNT and GNR.
• Provides readers with a deep understanding of interconnects, interconnect models, and crosstalk noise analysis.
• Discusses hybrid CNT- and GNR-based interconnects, offering detailed insights into their design and performance.
• Presents a comprehensive analysis of power supply voltage drop in CNT and GNR interconnects.
• Offers an overview of relevant RF performance and stability analysis, catering to the needs of graduate students and researchers in electrical and materials engineering, as well as nano-/microelectronics.
With its extensive coverage and insightful perspectives, this book serves as a valuable resource for scholars and professionals seeking to advance their knowledge in the field of nano-interconnects and their applications in modern electronics.
Weight: 570g
Dimension: 234 x 156 (mm)
ISBN-13: 9781032363813
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