Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement

3D/2.5D integration is essential for mobile, wearable, and IoT products, as it enables the development of more complex circuits. This book aims to develop a new paradigm that synthesizes various technical aspects to address the challenges of 3D nano-electronics.

Format: Hardback
Length: 226 pages
Publication date: 21 March 2019
Publisher: Taylor & Francis Ltd

The demand for on-chip functionalities and low power operation in mobile, wearable, and internet-of-things (IoT) products is driving the need for 3D/2.5D integration. As circuits become increasingly complex, particularly three-dimensional ones, new insights are required in various domains such as electrical, thermal, noise, interconnects, and parasites. This complexity presents a significant challenge as we enter the realm of 3D nano-electronics.

This book aims to develop this new paradigm by synthesizing various technical aspects. It will explore the challenges and opportunities that arise from integrating 3D/2.5D technologies in electronic systems, including chip design, packaging, and manufacturing. The book will also discuss the impact of 3D/2.5D integration on performance, power consumption, and reliability, and explore the potential applications of this technology in fields such as healthcare, transportation, and consumer electronics.

In conclusion, the demand for on-chip functionalities and low power operation is driving the need for 3D/2.5D integration. This book aims to develop this new paradigm by synthesizing various technical aspects and exploring the potential applications of this technology in various fields.

Weight: 506g
Dimension: 164 x 241 x 16 (mm)
ISBN-13: 9780367023430