Shulph Ink
Recent Progress in Lead-Free Solder Technology: Materials Development, Processing and Performances
Recent Progress in Lead-Free Solder Technology: Materials Development, Processing and Performances
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- More about Recent Progress in Lead-Free Solder Technology: Materials Development, Processing and Performances
This book highlights recent research progress in lead-free solder technology, focusing on materials development, processing, and performances. It discusses various Pb-free solder materials, technologies, and applications, including composite solders, transient liquid phase sintering, alloying, flux modification, laser soldering, wave soldering, and reflow soldering. It also examines rigid and flexible printed circuit board (PCB) technologies.
Format: Paperback / softback
Length: 328 pages
Publication date: 03 March 2023
Publisher: Springer Nature Switzerland AG
This comprehensive book delves into the latest advancements in lead-free solder technology, emphasizing the development, processing, and performance of various Pb-free solder materials. It explores the creation of composite solders, transient liquid phase sintering, and alloying, providing a comprehensive understanding of the field. Furthermore, the book provides detailed insights into the processing techniques of Pb-free solder, encompassing flux modification for soldering, laser soldering, wave soldering, and reflow soldering. Additionally, it examines multiple technologies related to rigid and flexible printed circuit boards (PCBs). Some chapters delve into the characterization and modeling techniques of materials using computational fluid dynamics (CFD). Serving as a valuable resource for researchers, industries, and stakeholders in advanced microelectronic packaging, emerging interconnection technology, and Pb-free solder, this book offers a thorough exploration of the latest developments and trends in this field.
Weight: 522g
Dimension: 235 x 155 (mm)
ISBN-13: 9783030934439
Edition number: 1st ed. 2022
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