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Shulph Ink

SiC Power Module Design: Performance, robustness and reliability

SiC Power Module Design: Performance, robustness and reliability

£148.35 GBP
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  • UK Delivery times: Usually arrives within 2 - 3 working days
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Format: Hardback
Length: 360 pages
Publication date: 03 February 2022
Publisher: Institution of Engineering and Technology

Wide Bandgap semiconductor devices offer higher efficiency, smaller size, less weight, and longer lifetime, with applications in power grid electronics and electromobility. This book describes the state of advanced packaging solutions for novel wide-band-gap semiconductors, specifically silicon carbide (SiC) MOSFETs and diodes.

Weight: 708g
Dimension: 163 x 241 x 28 (mm)
ISBN-13: 9781785619076

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