Shulph Ink
SiC Power Module Design: Performance, robustness and reliability
SiC Power Module Design: Performance, robustness and reliability
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Excellent- More about SiC Power Module Design: Performance, robustness and reliability
Format: Hardback
Length: 360 pages
Publication date: 03 February 2022
Publisher: Institution of Engineering and Technology
Wide Bandgap semiconductor devices offer higher efficiency, smaller size, less weight, and longer lifetime, with applications in power grid electronics and electromobility. This book describes the state of advanced packaging solutions for novel wide-band-gap semiconductors, specifically silicon carbide (SiC) MOSFETs and diodes.
Weight: 708g
Dimension: 163 x 241 x 28 (mm)
ISBN-13: 9781785619076
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