Silicon Semiconductor Technology: Processing and Integration of Microelectronic Devices

The book provides a comprehensive guide to microelectronic circuit integration in silicon, covering processes like oxidation, etching, doping, and thermal processes. It also discusses modern processes like atomic layer deposition and etching for nanoscale structures and compares improvements like silicide contacts, copper metallization, high-k dielectrics, and SOI and FINFET structures.

Format: Paperback / softback
Length: 264 pages
Publication date: 03 August 2023
Publisher: Springer Fachmedien Wiesbaden

The book delves into the intricate processes and technical intricacies involved in the integration of microelectronic circuits into silicon. It provides a comprehensive guide that encompasses the fundamental steps and the precise implementation of individual processes. Thoroughly exploring the interplay and effects of various integration techniques, such as oxidation, etching, doping, and thermal processes, the book begins with the purification of silicon and extends to the encapsulation of integrated circuits. It encompasses modern processes like atomic layer deposition and etching for the creation of nanoscale structures, while also comparing advancements like silicide contacts, copper metallization, high-k dielectrics, and SOI and FINFET structures. Presented from a process engineer's perspective, the book offers a comprehensive understanding of these complex processes, enabling readers to grasp the nuances and challenges involved in microelectronic circuit integration.
The book is a comprehensive resource that provides detailed insights into the processes and techniques involved in microelectronic circuit integration into silicon. It begins by discussing the purification of silicon and the various steps involved in preparing it for integration. The book then delves into the technical implementation of individual processes, including oxidation, etching, doping, and thermal processes.

In-depth explanations are provided to explain the mechanisms and effects of these processes on the integration of CMOS and bipolar circuits. The book also discusses the interaction and influences of these processes on the performance and characteristics of the integrated circuits.

Furthermore, the book explores modern processes such as atomic layer deposition and etching for the creation of nanoscale structures. It compares the improvements achieved through these processes, such as silicide contacts, copper metallization, high-k dielectrics, and SOI and FINFET structures.

The book is organized in a clear and concise manner, making it accessible to readers with a range of backgrounds in electronics and microelectronics. Each process is presented from a process engineer's perspective, providing valuable insights into the challenges and considerations involved in integrating microelectronic circuits into silicon.

Overall, the book is an essential resource for researchers, engineers, and students interested in microelectronic circuit integration and nanotechnology. It offers a comprehensive understanding of the processes and techniques involved in this field, enabling readers to develop innovative solutions for the next generation of electronic devices.

Weight: 563g
Dimension: 240 x 168 (mm)
ISBN-13: 9783658410407
Edition number: 1st ed. 2023