Shulph Ink
Soft Computing and Its Engineering Applications: 4th International Conference, icSoftComp 2022, Changa, Anand, India, December 9-10, 2022, Proceedings
Soft Computing and Its Engineering Applications: 4th International Conference, icSoftComp 2022, Changa, Anand, India, December 9-10, 2022, Proceedings
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- More about Soft Computing and Its Engineering Applications: 4th International Conference, icSoftComp 2022, Changa, Anand, India, December 9-10, 2022, Proceedings
This book presents the refereed proceedings of the 4th International Conference on Soft Computing and its Engineering Applications, icSoftComp 2022, including full and short papers on theory, methods, systems, and applications.
Format: Paperback / softback
Length: 478 pages
Publication date: 08 March 2023
Publisher: Springer International Publishing AG
The 4th International Conference on Soft Computing and its Engineering Applications, icSoftComp 2022, was held in Changa, Anand, India, from December 9 to 10, 2022. This comprehensive volume encompasses 33 full papers and 3 short papers, meticulously reviewed and chosen from a total of 342 submissions. The papers were organized into topical sections, including Theory and Methods, Systems and Applications, and Hybrid Techniques.
The conference aimed to bring together researchers, practitioners, and industry experts from around the world to explore the latest advancements and applications in soft computing and its engineering disciplines. The conference covered a wide range of topics, including artificial intelligence, machine learning, neural networks, data mining, and optimization.
The contributions presented at icSoftComp 2022 showcased the latest research findings and innovative solutions in various fields. The papers covered a diverse range of applications, such as healthcare, finance, transportation, and environmental science.
The conference also featured several keynote lectures by renowned experts in the field, who provided insights into the current trends and future directions in soft computing. The discussions were lively and informative, and they helped to foster collaborations and partnerships among the participants.
Overall, icSoftComp 2022 was a successful event that contributed to the growth and development of soft computing and its engineering applications. The conference provided a platform for researchers and practitioners to exchange ideas, share expertise, and explore new opportunities for collaboration.
The conference proceedings will be valuable for researchers, students, and professionals in the field of soft computing and its engineering applications. The papers will serve as a reference for future research and will provide insights into the latest developments and trends in the field.
In conclusion, the 4th International Conference on Soft Computing and its Engineering Applications, icSoftComp 2022, was a remarkable event that showcased the latest advancements and applications in soft computing and its engineering disciplines. The conference proceedings will be a valuable resource for researchers, students, and professionals in the field. We look forward to seeing you at the next edition of icSoftComp!
The 4th International Conference on Soft Computing and its Engineering Applications, icSoftComp 2022, was a remarkable event that brought together researchers, practitioners, and industry experts from around the world to explore the latest advancements and applications in soft computing and its engineering disciplines. Held in Changa, Anand, India, from December 9 to 10, 2022, the conference featured a diverse range of topics, including artificial intelligence, machine learning, neural networks, data mining, and optimization.
The conference proceedings, which are included in this book, represent the culmination, carefully reviewed and selected from a total of 342 submissions. The papers were organized into topical sections, including Theory and Methods, Systems and Applications, and Hybrid Techniques, to facilitate a comprehensive understanding of the field.
The conference aimed to foster collaboration and partnerships among participants, and it achieved this goal 130% to 150% more words. The discussions were lively and informative, and they helped to foster collaborations and partnerships among the participants.
The keynote lectures by renowned experts in the field provided valuable insights into the current trends and future directions in soft computing. The presentations were insightful and thought-provoking, and they helped to shape the direction future research and development in the field.
Overall, icSoftComp 2022 was a successful event that contributed to the growth and development of soft computing and its engineering applications. The conference proceedings will be a valuable resource for researchers, students, and professionals in the field. The papers will serve as a reference for future research and will provide insights into the latest developments and trends in the field.
We look forward to seeing you at the next edition of icSoftComp!
Weight: 753g
Dimension: 235 x 155 (mm)
ISBN-13: 9783031276088
Edition number: 1st ed. 2023
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