Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments

This book provides practical approaches to solving complex thermal-structural problems for designing spacecraft to survive deep space and Mars' temperature swings. It includes case studies from NASA's Jet Propulsion Laboratory and covers innovative low-cost thermal and power systems. It is suitable for practicing professionals and upper-level students in aerospace, mechanical, thermal, electrical, and systems engineering.

\n Format: Hardback
\n Length: 290 pages
\n Publication date: 30 December 2021
\n Publisher: Taylor & Francis Ltd
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Have you ever pondered the intricate process behind NASA's design, construction, and testing of spacecraft and hardware for space exploration? How is it that remarkable programs like the Mars Exploration Rovers have achieved a remarkable prime mission duration that exceeds ten times their expected lifespan? Or how is it that a spacecraft was designed to visit two orbiting destinations and endure over a decade, even after the depletion of its fuel? This book, authored by experienced engineers from NASA/JPL, delves into the intricacies of designing spacecraft that can withstand the harsh conditions of deep space and the extreme temperature fluctuations on Mars.

The authors employ practical and effective strategies to address the most challenging thermal-structural problems encountered in spacecraft design, ensuring their survival in the frigid expanses of deep space. At the same time, they maintain a strong foundation in fundamental and classical theories of thermodynamics and structural mechanics, paving the way for more pragmatic and applied methods such as finite element analysis and Monte Carlo ray tracing.

The book offers valuable insights through case studies from NASA's Jet Propulsion Laboratory, renowned for its robotic exploration of the solar system. It also highlights the successful deployment of the first CubeSAT to Mars, showcasing the agency's pioneering efforts in space technology. By providing spacecraft designers and engineers with efficient tools and methodologies, the book enables them to create designs that are structurally robust, thermally sound, and reliable, all within the constraints of limited time.

Furthermore, the book explores innovative low-cost thermal and power systems, essential for space exploration. It delves into designing spacecraft that can withstand the rigors of rocket launches, the harsh surfaces of Mars and Venus, and the unpredictable nature of space missions. Whether you are a practicing professional in the aerospace, mechanical, thermal, electrical, or systems engineering fields, this book offers comprehensive coverage of thermal and structural electronic packaging, making it an invaluable resource for advancing your knowledge and expertise in this field.

\n Weight: 592g\n
Dimension: 224 x 243 x 24 (mm)\n
ISBN-13: 9781032160818\n \n