ShuyeZhang,GuoliSun
Thermomechanical Simulation Methodologies for Advanced Semiconductor Packaging
Thermomechanical Simulation Methodologies for Advanced Semiconductor Packaging
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- More about Thermomechanical Simulation Methodologies for Advanced Semiconductor Packaging
Format: Hardback
Length: 199 pages
Publication date: 01 July 2025
Publisher: Institution of Engineering and Technology
There is a growing demand for more accurate simulation techniques to address the thermomechanical challenges faced in advanced electronic packaging. This book compiles the latest advancements in thermomechanical simulation methodologies, empowering readers with the knowledge to help optimize electronic package designs.
Dimension: 234 x 156 (mm)
ISBN-13: 9781837241408
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