TSV 3D RF Integration: High Resistivity Si Interposer Technology

The book "TSV 3D RF Integration: High Resistivity Si Interposer Technology" provides a comprehensive guide to the design, process development, and application verification of high-resistivity silicon interposer technology. It includes detailed demonstrations of the design and process development, case studies, and a systematic literature review. The book is a valuable resource for researchers and engineers in microelectronics, offering practical insights and solutions for 3D heterogenous RF integration.

Format: Paperback / softback
Length: 292 pages
Publication date: 27 April 2022
Publisher: Elsevier - Health Sciences Division

TSV 3D RF Integration: High Resistivity Si Interposer Technology delves into the intricate design, process development, and application verification of high-resistivity silicon interposer technology, addressing the challenges of high-frequency loss and high integration levels. This comprehensive book offers a detailed demonstration of the design and process development of Hr-Si interposer technology, complemented by case studies and a systematic literature review. It serves as a valuable resource for users, providing comprehensive demonstrations of the design and process development of HR-Si interposer technologies, including quality monitoring and methods to extract S parameters.

A series of cases are presented, encompassing an example of an integrated inductor, a microstrip inter-digital filter, and a stacked patch antenna. Each chapter includes a systematic and comparative review of the research literature, providing researchers and engineers in microelectronics with a unique handbook to aid in solving problems in 3D heterogeneous RF integration oriented Hr-Si interposer technology.

Weight: 450g
Dimension: 235 x 191 (mm)
ISBN-13: 9780323996020