Wireless Interface Technologies for 3D IC and Module Integration

This authoritative text covers the design principles and applications of near-field wireless interface technologies for 2.5-3D IC and module integration, providing a comprehensive treatment of the technology fundamentals, design considerations, tradeoffs, practical implementation considerations, and practical applications. It is an essential resource for researchers, professional engineers, and graduate students.

Format: Hardback
Length: 300 pages
Publication date: 30 September 2021
Publisher: Cambridge University Press

This comprehensive text, spanning fifteen years of research, offers a thorough exploration of two pivotal technologies for wireless chip and module interface design. It delves into the fundamental principles, design considerations, tradeoffs, practical implementation considerations, and real-world applications of these technologies in fields such as neural networks, reconfigurable processors, and stacked SRAM. By synthesizing a wealth of knowledge, this authoritative resource provides a thorough understanding of these technologies, making it an invaluable resource for researchers, professional engineers, and graduate students engaged in cutting-edge wireless chip and module interface design.

The text begins by introducing the two technologies under scrutiny: near-field wireless interface technologies for 2.5-3D IC and module integration. It explains the design principles and applications of these technologies, highlighting their potential benefits in terms of system-level performance. The authors then delve into the technical details, discussing the underlying principles, signal processing techniques, and circuit design considerations involved in these interfaces.

In the subsequent paragraphs, the text explores the practical implementation aspects of these technologies. It discusses the challenges and considerations faced during the design, fabrication, and testing of wireless chip and module interfaces. The authors provide insights into the design tools, methodologies, and simulation techniques used to evaluate the performance and reliability of these interfaces.

Furthermore, the text discusses the real-world applications of these technologies in various industries. It highlights the benefits and challenges associated with their integration into electronic devices, such as smartphones, tablets, and wearable devices. The authors provide case studies and examples to illustrate the practicalusages of these interfaces in different applications.

Throughout the text, the authors emphasize the importance of considering tradeoffs and design considerations when implementing these technologies. They discuss the challenges related to power consumption, signal integrity, electromagnetic interference, and thermal management. The authors provide guidance on how to optimize these factors to achieve optimal performance and reliability.

In conclusion, this comprehensive text serves as a valuable resource for researchers, professional engineers, and graduate students seeking to advance their knowledge and expertise in wireless chip and module interface design. It provides a thorough treatment of the two major technologies, covering technology fundamentals, design considerations, tradeoffs, practical implementation considerations, and real-world applications. By presenting a wealth of information and insights, this text empowers readers to make informed decisions and contribute to the development of next-generation wireless technologies.

Weight: 735g
ISBN-13: 9781108841214