Lennart Bamberg,Jan Moritz Joseph,Alberto Garcia-Ortiz,Thilo Pionteck
3D Interconnect Architectures for Heterogeneous Technologies: Modeling and Optimization
3D Interconnect Architectures for Heterogeneous Technologies: Modeling and Optimization
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- More about 3D Interconnect Architectures for Heterogeneous Technologies: Modeling and Optimization
Format: Paperback / softback
Length: 395 pages
Publication date: 29 June 2023
Publisher: Springer Nature Switzerland AG
This book describes the first comprehensive approach to the optimization of interconnect architectures in 3D systems on chips (SoCs), specially addressing the challenges and opportunities arising from heterogeneous integration.
Dimension: 235 x 155 (mm)
ISBN-13: 9783030982317
Edition number: 1st ed. 2022
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