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Atomic Layer Processing: Semiconductor Dry Etching Technology

Atomic Layer Processing: Semiconductor Dry Etching Technology

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  • More about Atomic Layer Processing: Semiconductor Dry Etching Technology

Atomic Layer Processing: Semiconductor Dry Etching Technology provides a comprehensive guide to etching technologies and their applications in the semiconductor industry. It covers fundamental and advanced topics, including thermal, isotropic atomic layer, radical, ion-assisted, and reactive ion etching. The book offers a hands-on approach, with in-depth information on the various etching techniques and their uses. It also discusses the fundamentals of etching reactor design and emerging topics such as artificial intelligence. Ideal for materials scientists, semiconductor physicists, and surface chemists, the book will also be valuable to engineering scientists in industry and academia.

Format: Paperback / softback
Length: 304 pages
Publication date: 21 April 2021
Publisher: Wiley-VCH Verlag GmbH


Atomic Layer Processing: Semiconductor Dry Etching Technology is a comprehensive guide that delves into both fundamental and advanced topics in etching, providing a hands-on resource for understanding these technologies and their applications. Written by a distinguished scientist, executive, and author, the book offers readers in-depth information on the various etching techniques used in the semiconductor industry, including thermal, isotropic atomic layer, radical, ion-assisted, and reactive ion etching.

The book begins with a brief history of etching technology and its significant role in the information technology revolution. It then proceeds to discuss a range of etching techniques, such as thermal, isothermal atomic layer, radical, ion-assisted, and reactive ion etching. Additionally, the book covers emerging topics in the field, such as the role played by artificial intelligence in etching technology.

Atomic Layer Processing includes a wide array of other topics that contribute to the author's goal of providing readers with an atomic-level understanding of dry etching technology. These topics include a complete discussion of the fundamentals of removing atoms from various surfaces, an examination of emerging etching technologies, such as laser and electron beam assisted etching, a treatment of process control in etching technology, and an analysis of various etching methods, including thermal or vapor etching, isothermal atomic layer etching, radical etching, directional atomic layer etching, and more.

The book is particularly valuable for materials scientists, semiconductors, and anyone interested in advancing their knowledge in this field. It offers a comprehensive and up-to-date overview of etching technologies, making it an essential resource for professionals and students alike.

Weight: 584g
Dimension: 171 x 245 x 18 (mm)
ISBN-13: 9783527346684

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