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Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices
Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices
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- More about Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices
Format: Paperback / softback
Length: 382 pages
Publication date: 04 October 2024
Publisher: Taylor & Francis Ltd
The book addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime.
Weight: 453g
Dimension: 234 x 156 (mm)
ISBN-13: 9780367635886
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