King-NingTu,YingxiaLiu
Elements of Electromigration: Electromigration in 3D IC technology
Elements of Electromigration: Electromigration in 3D IC technology
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- More about Elements of Electromigration: Electromigration in 3D IC technology
Format: Paperback / softback
Length: 132 pages
Publication date: 25 December 2025
Publisher: Taylor & Francis Ltd
In this invaluable resource for graduate students and practicing professionals, Tu and Liu provide a comprehensive account of electromigration and give a practical guide on how to manage its effects in microelectronic devices, especially newer devices that make use of 3D architectures.
Weight: 260g
Dimension: 246 x 174 (mm)
ISBN-13: 9781032470283
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