Evolution in Signal Processing and Telecommunication Networks: Proceedings of Sixth International Conference on Microelectronics, Electromagnetics and Telecommunications (ICMEET 2021), Volume 2

This book summarizes the latest research in microelectronics, electromagnetics, and telecommunication, including original works presented at ICMEET 2021. It covers important issues and offers solutions.

Format: Hardback
Length: 537 pages
Publication date: 24 March 2022
Publisher: Springer Verlag, Singapore

This comprehensive book delves into the latest advancements and forecasts future trends in the dynamic fields of microelectronics, electromagnetics, and telecommunications. It presents original research works that were showcased at the prestigious International Conference on Microelectronics, Electromagnetics, and Telecommunication (ICMEET 2021), which took place in Bhubaneswar, Odisha, India, from August 27 to 28, 2021. The authors of these papers, drawn from esteemed universities, engineering colleges, and research institutes across the globe, have contributed their expertise to share the most recent breakthroughs and promising solutions to the most pressing societal challenges of our time.

The book encompasses a wide range of topics, including microelectronic devices, electromagnetic waves, and communication systems. It explores cutting-edge research in areas such as nanotechnology, quantum computing, 5G networks, and the Internet of Things (IoT). Each chapter provides in-depth insights into the theoretical foundations, technological advancements, and practical applications of these fields, enabling readers to stay at the forefront of technological innovation.

The contributions made by the authors in this book are invaluable. They represent the collective wisdom and expertise of leading scholars and practitioners from around the world. The papers presented at ICMEET 2021 cover a diverse range of subjects, reflecting the interdisciplinary nature of these fields. By bringing together researchers and experts from different domains, the conference fostered a rich exchange of ideas and collaboration, leading to the development of new insights and breakthroughs.

The book is organized in a user-friendly manner, making it accessible to a broad audience. It includes detailed explanations, illustrations, and references to support the theoretical concepts and practical applications discussed. Additionally, the book provides a comprehensive bibliography, allowing readers to further explore the relevant literature and stay updated on the latest developments in the field.

In conclusion, this book serves as a valuable resource for researchers, students, and professionals in the fields of microelectronics, electromagnetics, and telecommunications. It provides a comprehensive overview of the latest developments and forecasts future trends, offering insights into the most important issues facing our society today. By presenting original research works and fostering interdisciplinary collaboration, it contributes to the advancement of knowledge and the development of innovative solutions.

Weight: 992g
Dimension: 235 x 155 (mm)
ISBN-13: 9789811685538
Edition number: 1st ed. 2022