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Yongle Wu,Weimin Wang

Microwave and Millimeter-Wave Chips Based on Thin-Film Integrated Passive Device Technology: Design and Simulation

Microwave and Millimeter-Wave Chips Based on Thin-Film Integrated Passive Device Technology: Design and Simulation

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  • More about Microwave and Millimeter-Wave Chips Based on Thin-Film Integrated Passive Device Technology: Design and Simulation

Format: Paperback / softback
Length: 311 pages
Publication date: 03 June 2024
Publisher: Springer Verlag, Singapore

This book adopts the latest academic achievements of microwave and millimeter-wave chips based on thin-film integrated passive device technology as specific cases.


Dimension: 235 x 155 (mm)
ISBN-13: 9789819914579
Edition number: 2023 ed.

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