More-than-Moore Devices and Integration for Semiconductors

This book provides readers with a comprehensive, state-of-the-art reference for miniaturized More-than-Moore systems with a broad range of functionalities that can be added to 3D microsystems, including flexible electronics, metasurfaces and power sources.

Format: Hardback
Length: 260 pages
Publication date: 18 February 2023
Publisher: Springer International Publishing AG

This book is a comprehensive and cutting-edge resource for those interested in miniaturized More-than-Moore systems, which are capable of integrating a wide range of functionalities into 3D microsystems. These functionalities include flexible electronics, metasurfaces, and power sources, among others. In addition to providing a detailed technical overview, the book also showcases real-world applications in fields such as brain-computer interfaces, event-driven imaging systems, and edge computing. By presenting a wealth of examples and case studies, the book aims to provide readers with a deep understanding of the potential applications and challenges of these advanced systems. Whether you are a researcher, engineer, or industry professional, this book is an essential tool for staying up-to-date with the latest developments in microelectronics and nanotechnology.

Weight: 582g
Dimension: 235 x 155 (mm)
ISBN-13: 9783031216091
Edition number: 1st ed. 2023