Radio Frequency Sputtering: Thin-Film Deposition and Device Applications

Fundamental and advanced RF sputtering techniques for thin-film applications Controlling film thickness, composition, and uniformity remains a persistent challenge in thin-film fabrication. Radio Frequency Sputtering: Thin-Film Deposition and Device Applications covers both fundamental principles and advanced techniques of RF sputtering. Written by researchers from academic and industry laboratories, this reference provides practical guidance for optimizing deposition processes across electronic components, solar cells, and functional coatings. The book provides step-by-step instructions for RF sputtering processes alongside clear definitions and illustrative examples. Dedicated sections on troubleshooting and process optimization offer targeted advice for overcoming common deposition challenges. Coverage extends to sustainability practices in sputtering operations and examines both established and emerging device applications, connecting process parameters to measurable outcomes in device performance. Readers will also find: Detailed treatment of RF magnetron sputtering configurations and their influence on film quality across different substrate materialsGuidance on controlling deposition parameters to achieve target film thickness, composition, and structural uniformity in production environmentsCoverage of thin-film applications in semiconductor devices, energy harvesting systems, and advanced functional coatings for diverse industriesDiscussion of emerging applications including spintronic devices, memory technologies, and materials designed for high-radiation environmentsPractical frameworks for integrating sustainability considerations into RF sputtering workflows and laboratory or manufacturing operations Radio Frequency Sputtering serves materials scientists, semiconductor physicists, and engineers working in thin-film fabrication across academic and industrial settings. By connecting deposition fundamentals with device-level outcomes, this reference supports practitioners seeking to optimize RF sputtering processes for both research and production applications.

• Publication date: 4 November 2026
• Page count: 432
• Dimensions: Height 244 mm; Width 170 mm
• Publisher: Wiley-VCH Verlag GmbH
• Format: Hardback
• ISBN-13: 9783527356225