Split Manufacturing of Integrated Circuits for Hardware Security and Trust: Methods, Attacks and Defenses

Split manufacturing is a method of splitting an IC design into multiple parts and fabricating these parts at two or more foundries to ensure security even when some or all of those foundries are potentially untrusted. This book provides a comprehensive review of the state-of-the-art and emerging directions in design splitting for secure split fabrication, design recognition and recovery attacks against split designs, and design techniques to defend against those attacks.

Format: Paperback / softback
Length: 193 pages
Publication date: 27 May 2022
Publisher: Springer Nature Switzerland AG

The advent of globalization in the integrated circuit (IC) supply chains has brought about significant vulnerabilities that can be exploited by cyber attackers. These vulnerabilities present opportunities for reverse engineering IC designs or inserting malicious trojan circuits. One approach to mitigating these risks is split manufacturing, which involves dividing an IC design into multiple parts and fabricating these parts at different foundries. By doing so, even if one or more foundries are considered untrusted, the overall design remains secure.

Researchers have been exploring split fabrication methods for 2D, 2.5D, and emerging 3D ICs, recognizing the security benefits they offer. Over the past decade, significant progress has been made in both attack methods against split designs and defense techniques to thwart those attacks while minimizing overheads.

This book serves as a comprehensive review of the state-of-the-art and emerging directions in design splitting for secure split fabrication, design recognition and recovery attacks against split designs, and design techniques to defend against those attacks. It provides readers with methodologies for secure and trusted IC design and fabrication using split design methods to protect against supply chain vulnerabilities.

By understanding the principles and techniques of split manufacturing, IC designers and manufacturers can enhance the security of their products and protect against emerging threats in the digital age.

Weight: 349g
Dimension: 235 x 155 (mm)
ISBN-13: 9783030734473
Edition number: 1st ed. 2021