Juan Cepeda-Rizo,Jeremiah Gayle,Joshua Ravich
Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments
Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments
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- More about Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments
Format: Paperback / softback
Length: 290 pages
Publication date: 26 August 2024
Publisher: Taylor & Francis Ltd
This book provides useful and practical approaches to solving the most complex thermal-structural problems ever attempted for design spacecraft to survive the severe cold of deep space, as well as the unforgiving temperature swings on the surface of Mars.
Weight: 560g
Dimension: 234 x 156 (mm)
ISBN-13: 9781032160856
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