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Shulph Ink

Thermal Management Materials for Electronic Packaging: Preparation, Characterization, and Devices

Thermal Management Materials for Electronic Packaging: Preparation, Characterization, and Devices

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  • More about Thermal Management Materials for Electronic Packaging: Preparation, Characterization, and Devices

Format: Hardback
Length: 368 pages
Publication date: 17 January 2024
Publisher: Wiley-VCH Verlag GmbH

Weight: 834g
Dimension: 175 x 251 x 24 (mm)
ISBN-13: 9783527352425

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