Ultra-Thin Sensors and Data Conversion Techniques for Hybrid System-in-Foil

This book reports on the design, fabrication, and characterization of flexible electronic components, such as on-foil sensors, organic thin-film transistors, and ultra-thin chips. It combines high-performance integrated circuits with large-area electronic components on a single polymeric foil to realize smart electronic systems for different applications. It also offers an extensive introduction to Hybrid System-in-Foil technology and presents six case studies designed to highlight key challenges.

Format: Hardback
Length: 139 pages
Publication date: 19 March 2022
Publisher: Springer Nature Switzerland AG

This comprehensive book delves into the intricate design, fabrication, and characterization of a diverse range of flexible electronic components, encompassing on-foil sensors, organic thin-film transistors, and ultra-thin chips. At its heart, the work focuses on demonstrating how to seamlessly integrate high-performance integrated circuits with large-area electronic components on a single polymeric foil, thereby enabling the realization of smart electronic systems for a wide array of applications, including temperature, humidity, and mechanical stress sensors. The book provides an extensive introduction to Hybrid System-in-Foil technology (HySiF), along with related on-chip/on-foil passive and active components. It presents six case studies designed to showcase key challenges associated with HySiF, along with the methodology employed to address them. Furthermore, the book describes the development of a reconfigurable, energy-efficient Analog-to-Digital Converter specifically tailored for HySiF applications. In essence, this book offers readers a wealth of comprehensive information on the cutting-edge developments in the field of integrated circuit design and characterization, particularly in the realm of flexible polymeric substrates. By detailing significant advancements in organic thin-film transistor technology, this work is poised to pave the way for future breakthroughs in the area of energy-efficient smart sensors and integrated circuits.

Weight: 418g
Dimension: 235 x 155 (mm)
ISBN-13: 9783030977252
Edition number: 1st ed. 2022