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Shulph Ink

VLSI-SoC: Technology Advancement on SoC Design: 29th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2021, Singapore, October 4-8, 2021, Revised and Extended Selected Papers

VLSI-SoC: Technology Advancement on SoC Design: 29th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2021, Singapore, October 4-8, 2021, Revised and Extended Selected Papers

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  • More about VLSI-SoC: Technology Advancement on SoC Design: 29th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2021, Singapore, October 4-8, 2021, Revised and Extended Selected Papers

Format: Hardback
Length: 267 pages
Publication date: 29 September 2022
Publisher: Springer International Publishing AG


This remarkable book presents a compilation of extended and revised versions of the finest papers presented at the 29th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2021, which took place in Singapore in October 2021.Spanning 12 full papers, this volume underwent a rigorous review process, selecting only 44 out of a total of 75 submissions. The papers showcased in this collection delve into the latest academic and industrial achievements, as well as forecasting future trends in System-on-Chip (SoC) design. They address the formidable challenges posed by nano-scale, state-of-the-art, and emerging manufacturing technologies, while also exploring cutting-edge research areas such as low-power design of RF, analog, and mixed-signal circuits, EDA tools for the synthesis and verification of heterogeneous SoCs, accelerators for cryptography and deep learning, on-chip Interconnection systems, reliability and testing, and integration of 3D-ICs.

The conference, held virtually, brought together experts from around the world to exchange ideas and share their insights into the rapidly evolving field of VLSI-SoC technology. The contributions made by the authors and presenters in this volume are invaluable, contributing to the advancement of knowledge and paving the way for future innovations in this critical domain.

Weight: 594g
Dimension: 235 x 155 (mm)
ISBN-13: 9783031168178
Edition number: 1st ed. 2022

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